The book "Interconnects of Integrated Circuits with a View to Emerging Technologies " authored by Dr. Mohammad Hossein Moayeri, Associate Professor at the Faculty of Electrical Engineering (Electronics and Communications), Shahid Beheshti University, and Dr. Soheila Gharavi-Hamedani, Assistant Professor at the Faculty of Electrical Engineering, Kermanshah University of Technology, has been published.
This book was first released in 2024 (1403 in the Iranian calendar) by Shahid Beheshti University Press. It comprises 274 pages in standard octavo size and is priced at 1,650,000 IRR.
With technological advancements and the continued miniaturization of modern chip dimensions, interconnects — which are among the most critical components of integrated circuits — have gained increasing importance. Thus, "Interconnects of Integrated Circuits with a View to Emerging Technologies " has been written to interpret key concepts and essential elements related to on-chip interconnects. It provides a step-by-step explanation of the modeling, evaluation, and performance enhancement processes of interconnects.
Divided into five chapters, the book first presents a comprehensive overview of the fundamentals of on-chip interconnects, followed by an analysis of their performance and reliability factors. Given the trend of technology scaling and the significant increase in device density on silicon, along with the reduction of supply voltage—particularly in sub-10 nanometer technologies—more accurate modeling is required for analyzing interconnect lines. Therefore, the book thoroughly examines the modeling, analysis, and evaluation of the structure and performance of copper, carbon nanotube, and graphene nanoribbon-based interconnects at sub-10 nanometer scales. Beyond foundational topics, the book also addresses more advanced subjects, including interconnect fabrication processes, crosstalk effects and mitigation strategies, skin effect, and electromigration. It explores interconnect performance in ternary logic and 3D mixed-signal integrated circuits, which are more susceptible to noise, in the presence of process variations. Emerging interconnects and the challenges of integrating them are also introduced. The book also discusses the basics and design challenges of optical, wireless, radio-frequency, and surface wave interconnects.
This book serves as a valuable and practical resource for faculty members and graduate students in electrical and computer engineering and can contribute significantly to cutting-edge research aligned with leading global universities.
Interested students and readers can purchase the book from the sales office of the Scientific Publications Center of Shahid Beheshti University, located on the ground floor of the Information Technology (IT) building. Online orders can also be placed through the center’s official website. Additionally, the electronic version of the book is available for purchase on the Fidibo and Taghche platforms.